Introduction
The analysis of organic additives in electroplating baths by cyclic voltametric stripping (CVS) is a robust method and widely used in the electroplating industry. To ensure that continuously reliable results are obtained standardized daily operation procedures are of highest importance. They all contribute to keep the measuring system at best performance.
The recommendations and descriptions in the following refer to the analysis of acid copper plating baths. For the analysis of other plating baths, e.g. tin, tin/lead or electroless copper plating baths some recommendations may not apply.
Checklist
In case of problems (unusual measuring curves, results out of expected range, bad reproducibility) please check the following items.
Problems and Possible Solutions
The following lists contain typical problematic phenomena, their possible causes and solutions.
General
DT - Dilution Titration
MLAT/LAT - (Modified) Linear Approximation Technique
RC - Response Curve
Additional Support
If you encounter any issues or need additional help, please submit a support ticket through Metrohm Technical Support.
For additional training on any of these topics, explore our Metrohm Custom Training options.